Copper electroless deposition on a titanium-containing surface
US6054173A · kind A · utility
16Cited by
17References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1997 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Aug 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/976
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.