Semiconductor device and method of manufacturing the same
US6054773A · kind A · utility
13Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 1998 |
| Grant date | Apr 25, 2000 |
| Priority date | — |
| Expiry date | Mar 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive sheet which has rigidity and a portion which adheres to the back surface of the outside portion of the film circuit is used. Specifically, there is used the adhesive sheet which is obtained by forming cushioning adhesive sheet layers on both the surfaces of the rigid sheet layer formed of stainless or the like. Further, the rigid sheet layer is also used for electrostatic shield. The co-planarity of external terminals (soldering balls) is enhanced without vainly increasing the weight of a semiconductor device, and further the resistance to high-frequency noses in the semiconductor device is enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.