Method for bonding a ceramic to a metal with a copper-containing shim
US6056186A · kind A · utility
15Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1997 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Jul 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are placed in contact with a ceramic layer and metal layer. The assembly, so formed, is then heated to a temperature at least equal to the melting point of the eutectic and no greater than the melting temperature of copper. Upon cooling of the eutectic, a bond forms bond the ceramic layer to the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.