Lee B. Max
6Patents
5h-index
5Co-inventors
56Inventor score
Filing activity: Oct 2, 1974 → Jun 8, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4193083A | Package for push-pull semiconductor devices | Electricity | 26 | Expired |
| US4242598A | Temperature compensating transistor bias device | Electricity | 19 | Expired |
| US4107728A | Package for push-pull semiconductor devices | Electricity | 15 | Expired |
| US6056186A | Method for bonding a ceramic to a metal with a copper-containing shim | Electricity | 15 | Expired |
| US5760473A | Semiconductor package having a eutectic bonding layer | Electricity | 10 | Expired |
| US6529081B1 | Method of operating a solid state power amplifying device | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.