Patent · US Expired

Method of attaching a component to a plate-shaped support

US6056188A · kind A · utility

4Cited by

4References

12Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Ghassem Azdasht · Berlin, DE
Paul Kasulke · Berlin, DE

Key dates

Filing date	May 12, 1998
Grant date	May 2, 2000
Priority date	—
Expiry date	May 12, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3494
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of attaching an electronic component to a surface of a plate-shaped support member has as a first step the step of applying the electronic component to the surface of the support member, a solder being arranged between the electronic component and the support member. Following this, a glass fiber or a glass fiber bundle is applied to the surface of the plate-shaped support member located opposite the electronic component. Finally, a laser pulse is conducted through the glass fiber or glass fiber bundle for melting the solder so as to establish a punctiform electrical and mechanical connection between the support member and the electronic component in this way.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.