Optical system for measuring and inspecting partially transparent substrates
US6057924A · kind A · utility
14Cited by
1References
14Claims
0Family size
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Key dates
| Filing date | Sep 4, 1998 |
| Grant date | May 2, 2000 |
| Priority date | — |
| Expiry date | Sep 4, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Techniques and systems for obtaining the thickness map of a partially transparent substrate in a nondestructive optical fashion. The thickness is determined by comparing the amount of absorption by the substrate to a calibrated amount obtained from a substrate standard with a known thickness that is formed of the same material. Digital signal processing operations are performed to reduce noise and to improve resolution of the thickness map.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.