Patent · US Expired

Device and a method for applying a plurality of solder globules to a substrate

US6059176A · kind A · utility

9Cited by

9References

10Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Ghassem Azdasht · Berlin, DE
Ramin Azadeh · Berlin, DE
Clemens Rüthnick · Berlin, DE
Martin Lange · Berlin, DE

Key dates

Filing date	Apr 7, 1998
Grant date	May 9, 2000
Priority date	—
Expiry date	Apr 7, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/107
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for applying a plurality of solder globules to a substrate has a solder-globule fixing method, a plurality of glass fibers and a fibre holder. The solder-globule fixing method has provided therein a plurality of passages whose cross-sectional areas are smaller than the cross-sectional areas ofthe solder globules to be applied. The fibre holder is arranged relative to the solder-globule fixing device in such a way that between the fibre holder and the solder-globule fixing device a cavity is formed, which is adapted to be acted upon when submitted to pressure via a pressure-transmitting conduit. The fibre holder holds the glass fibres in alignment with the passages.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.