Wafer polishing head drive
US6062961A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1997 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer polisher head drive includes a head drive housing; a head portion extending from the housing for mounting an unpolished wafer when the head drive housing and head portion are in a horizontal orientation; a pivot mechanism extending from the head drive housing for pivoting the head drive housing and the head portion from the horizontal orientation to a vertical orientation juxtaposed to a transverse vertical portion of a continuous rotating polishing belt; a drive in the housing for moving the head portion and a mounted wafer outwardly from the housing against the transverse vertical portion of the rotating polishing belt; and a drive in the housing for rotating the head portion and the mounted wafer. The head drive housing may be pivoted from the vertical orientation in a sweeping arc extending perpendicularly from the belt transverse vertical portion or in a swinging arc extending parallel from the belt transverse vertical portion. The pivot mechanism includes a hollow shaft connected to said head drive housing; and a motor, gearbox and a ball screw and nut assembly in driving connection between the gearbox and the hollow shaft for transversing in a direction parallel to t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.