Surface treatment for bonding pad
US6063207A · kind A · utility
24Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1999 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Feb 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface treatment method for bonding pad is described, in which a passivation layer is formed on a bonding pad and an opening is formed within the passivation by a plasma etching process. The bonding pad is corroded by the etching plasma containing fluorine during the etching process. The bonding pad is rinsed with deionized water comprising carbon dioxide to reduce the effects of the corrosion phenomenon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.