Copper alloys for chip and package interconnections
US6063506A · kind A · utility
64Cited by
17References
59Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1998 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Jun 8, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package interconnections and a method of making such interconnections and conductors by first forming the copper alloy and then annealing it to cause the diffusion of the alloying element toward the grain boundaries between the grains in the alloy are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.