Semiconductor integrated circuit failure analysis using magnetic imaging
US6064220A · kind A · utility
9Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1997 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Jul 29, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/315
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Magnetic sensors are positioned adjacent a semiconductor integrated circuit under test while the circuit is subjected to selected electrical stimuli for purposes of failure analysis. The magnetic image data can be acquired from one or more selected locations about the circuit without any physical connection. By comparing the magnetic sensor information to a predetermined database of magnetic information acquired from known devices, failure modes can be identified. Conventional tester equipment can be used for providing the electrical stimuli to the device under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.