Planarization method and system using variable exposure
US6064466A · kind A · utility
3Cited by
18References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1997 |
| Grant date | May 16, 2000 |
| Priority date | — |
| Expiry date | Oct 15, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0273
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for planarization of a semiconductor wafer is disclosed. The disclosed system includes a mask with at least a medium density pattern, where the pattern dimensions are below the resolving power of an exposure system. Less than full intensity of the exposing radiation passes through the medium density pattern of the mask to a resist layer and does not completely expose the underlying resist. Through adapting at least a portion of the mask to account for surface irregularities of a wafer's surface, improved planarization of the surface is achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.