Apparatus for cutting tie bars of semiconductor packages
US6065381A · kind A · utility
9Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1998 |
| Grant date | May 23, 2000 |
| Priority date | — |
| Expiry date | Mar 20, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9428
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for cutting tie bars of semiconductor packages unloads the semiconductor packages by continuously blowing air against the side of the packages after the tie bars are cut and the semiconductor packages are separated from lead frames. The packages are blown into a guide track which feeds into a storage tube. As a result, damage to the packages due to mechanical abrasion which may result from unloading with a pusher bar is prevented. Furthermore, the time required for unloading the semiconductor packages is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.