Patent · US Expired

Method for fabricating a cylindrical capacitor

US6066541A · kind A · utility

15Cited by
10References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 27, 1998
Grant dateMay 23, 2000
Priority date
Expiry dateApr 27, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/711

Abstract

A method for fabricating a cylindrical capacitor is provided. This invention uses a composite structure composed of stacked barrier/scarificing/mask layers to prevent the contact plug of the capacitor from being attacked by wet etchants. An insulating layer is formed over a substrate having a source region, a drain region, and a gate electrode. Then a barrier layer, a sacrificing layer and a mask layer are sequentially formed over the insulating layer. Next, a contact hole is formed over the source region and spacers are formed on the sidewalls of the contact hole. After a storage electrode of the capacitor is formed and exposed portions of the mask layer are removed, the sacrificing layer is isotropically etched using the spacers and the barrier layer as stopping layers. Thereafter, a capacitor dielectric layer and an opposite electrode are formed over the storage electrode thereby completing the capacitor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.