Polishing device and polishing cloth for semiconductor substrates

US6068540A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang Dickenscheid · Dresden, DE
• Goetz Springer · Dresden, DE

Key dates

• Filing date: May 18, 1998
• Grant date: May 30, 2000
• Expiry date: May 18, 2018

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B49/00
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The polishing device grinds or polishes semiconductor substrates. The device includes a polishing table, into which a measuring device is integrated and a through opening. A polishing cloth covers the polishing table. The polishing cloth has at least one opening formed therein which corresponds to the through opening in the polishing table. The invention also relates to a polishing cloth for use in the polishing device.