Apparatus and method for separating a stiffener member from a flip chip integrated circuit package substrate
US6068727A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 1998 |
| Grant date | May 30, 2000 |
| Priority date | — |
| Expiry date | May 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method are presented for separating a stiffener member from a substrate of a flip chip integrated circuit package such that the substrate is not damaged. The apparatus includes a base plate for receiving an upper portion of the device package including the stiffener, and a hand tool for receiving a lower portion of the device package including the substrate. During use, the base plate engages the upper portion of the device package and the hand tool engages the lower portion. The hand tool is moved in relation to the base plate such that an adhesive layer joining the stiffener and substrate is broken (i.e., sheared), and the stiffener is separated from the substrate. As the adhesive layer is typically an amorphous polymer material which softens with increased temperature, the base plate is preferably heated prior to effecting the movement of the hand tool in relation to the base plate. The base plate may be, for example, attached to an upper surface of a hot plate which is heated during operation of the hot plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.