Semiconductor device manufacturing apparatus employing vacuum system
US6071350A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Dec 1, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for manufacturing a semiconductor device employs a vacuum system, in which a heating source is installed in a predetermined portion of a venting-gas inlet. A venting-speed controlling valve is installed in a predetermined portion of an exhaust pipe, for controlling the speed of gas flowing from a load lock chamber to a pump by controlling the opening and closing thereof. An exhaust pipe may have a main pipe with different diameters in different portions to reduce the venting speed. Accordingly, condensation-induced particle formation can be reduced by thus preventing adiabatic expansion of the gas in a load lock chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.