Method of manufacturing semiconductor device
US6071755A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1999 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Jul 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. The device may be manufactured by bonding a semiconductor substrate to a transferring substrate on which a lead pattern is formed, resin encapsulating an upper portion of the transferring substrate to cover the semiconductor substrate, and removing only the transferring substrate with the lead pattern left bonded to the encapsulating resin and the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.