Thermally enhanced test socket
US6072322A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Dec 30, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test socket having a heat slug for removing heat from an electronic device positioned within the socket. In one embodiment the test socket includes a burn-in board electrically coupled to a test unit that generates a series of test signals to test the performance of the electronic device. Examples of electronic devices that can be tested by the test socket are integrated circuit packages such as tape carrier packages (TCP), ball grid arrays (BGA), pin grid arrays (PGA), land grid arrays (LGA), and other packages. The integrated circuit package is positioned within the socket which electrically connects the package to a printed circuit board, such as a burn-in board. The test socket includes an opening in which a heat slug is disposed. The heat slug has a contact surface that contacts the integrated circuit device under test. In another embodiment, the socket includes a lid having a heat slug attached to the lid, which heat slug has a contact surface that contacts an integrated circuit device under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.