Inventor · Phoenix, AZ, US

Ram Viswanath

47Patents
9h-index
91Co-inventors
78Inventor score

Filing activity: Dec 30, 1997 → Jun 21, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US5944093A Pickup chuck with an integral heat pipe Electricity 108 Expired
US6189601A Heat sink with a heat pipe for spreading of heat Electricity 71 Expired
US6019166A Pickup chuck with an integral heatsink Electricity 43 Expired
US6072322A Thermally enhanced test socket Physics 19 Expired
US6049217A Thermally enhanced test contactor Physics 16 Expired
US8513792B2 Package-on-package interconnect stiffener Electricity 14 Active
US9129958B2 3D integrated circuit package with window interposer Electricity 13 Active
US6493223B1 Computer utilizing refrigeration for cooling Physics 13 Expired
US6575766B1 Laminated socket contacts Electricity 13 Expired
US9265170B2 Integrated circuit connectors Emerging Cross-Sectional Technologies 7 Active
US6888722B2 Thermal design for minimizing interface in a multi-site thermal contact condition Electricity 6 Expired
US9324678B2 Low profile zero/low insertion force package top side flex cable connector architecture Electricity 4 Active
US9832876B2 CPU package substrates with removable memory mechanical interfaces Emerging Cross-Sectional Technologies 4 Active
US11270942B2 Pitch translation architecture for semiconductor package including embedded interconnect bridge Electricity 3 Active
US10187996B2 Printed circuit board with a recess to accommodate discrete components in a package Electricity 3 Active
US9674954B2 Chip package connector assembly Emerging Cross-Sectional Technologies 3 Active
US6979208B2 Laminated socket contacts Electricity 2 Expired
US10643945B2 Pitch translation architecture for semiconductor package including embedded interconnect bridge Electricity 2 Active
US10424561B2 Integrated circuit structures with recessed conductive contacts for package on package Electricity 2 Active
US6672880B2 Laminated socket contacts Electricity 2 Expired
US11302643B2 Microelectronic component having molded regions with through-mold vias Electricity 2 Active
US11705398B2 Pitch translation architecture for semiconductor package including embedded interconnect bridge Electricity 2 Active
US6854979B2 Laminated socket contacts Electricity 2 Expired
US10784204B2 Rlink—die to die channel interconnect configurations to improve signaling Electricity 2 Active
US9603247B2 Electronic package with narrow-factor via including finish layer Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.