Laser segmentation of plated through-hole sidewalls to form multiple conductors
US6073344A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1999 |
| Grant date | Jun 13, 2000 |
| Priority date | — |
| Expiry date | Jan 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for generating multiple conductor segments within a plated through hole of a printed circuit board. The method utilizes laser light to define the segmented surfaces bounding a hole in a circuit board. Two embodiments of this method are a subtractive process and an additive process. The subtractive process starts with a plated through hole and uses a laser to removes vertical strips of the PTH conductive lining to form the multiple conductive segments. The additive process applies a seeding material to a bare hole in a circuit board, removes vertical strips of the seeding material via laser scanning, and applies an electrically conductive material to the seeded surfaces to form the multiple conductive segments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.