Apparatus for holding substrate to be polished
US6074289A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1997 |
| Grant date | Jun 13, 2000 |
| Priority date | — |
| Expiry date | Dec 16, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for holding a substrate to be polished comprises: a rotating rotary shaft; a substrate holding head in the form of a disc; a sealing member provided to the back face of the substrate holding head; a guiding member which is provided to the back face of the substrate holding head to be located outside the sealing member; and a fluid flow path which vertically penetrates the inside of the substrate holding head. The fluid flow path allows an air under pressure introduced from the upper end side thereof to flow out through the opening at the lower end thereof to a space. The sealing member is formed with a ventilation body having a large number of successive vent openings in the inside such as nonwoven fabric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.