Lead frame
US6078097A · kind A · utility
19Cited by
2References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 21, 1997 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Jan 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a lead frame, leads are formed on a surface of protective insulation film having a device hole. Protruding electrodes (solder balls) are formed on the surface of the leads opposite the surface closer to the protective insulation film. A reinforcement plate is also formed on the rear surface of the protective insulation film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.