Lead frame structure for preventing the warping of semiconductor package body
US6078099A · kind A · utility
11Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1999 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Feb 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.