Walsin Advanced Electronics Ltd.
15Patents
0Active
15Granted
30Portfolio score
Filing activity: Feb 16, 1999 → May 29, 2002
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6337510B1 | Stackable QFN semiconductor package | Electricity | 250 | Expired |
| US6437429B1 | Semiconductor package with metal pads | Electricity | 214 | Expired |
| US6459148B1 | QFN semiconductor package | Electricity | 179 | Expired |
| US6385049B1 | Multi-board BGA package | Electricity | 59 | Expired |
| US6521485B2 | Method for manufacturing wafer level chip size package | Electricity | 28 | Expired |
| US6762118B2 | Package having array of metal pegs linked by printed circuit lines | Electricity | 21 | Expired |
| US6204553A | Lead frame structure | Electricity | 21 | Expired |
| US6278182A | Lead frame type semiconductor package | Electricity | 20 | Expired |
| US6380624B1 | Stacked integrated circuit structure | Electricity | 17 | Expired |
| US6078099A | Lead frame structure for preventing the warping of semiconductor package body | Electricity | 11 | Expired |
| US6380062B1 | Method of fabricating semiconductor package having metal peg leads and connected by trace lines | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6262475A | Lead frame with heat slug | Electricity | 7 | Expired |
| US6486564B2 | Heat dissipation module for a BGA IC | Electricity | 4 | Expired |
| US6650005B2 | Micro BGA package | Electricity | 3 | Expired |
| US6459162B1 | Encapsulated semiconductor die package | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.