Semiconductor die package for mounting in horizontal and upright configurations
US6078102A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1998 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Mar 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die package includes a housing and a plurality of leads extending through openings in the housing. The package is designed to be mounted to a printed circuit board in both a horizontal configuration and in an upright configuration. In the horizontal configuration, the face of the die is held parallel to the surface of the printed circuit board. An edge of the die faces the printed circuit board when the package is mounted in an upright configuration. The leads are L-shaped so that either an end surface or an outer side surface of the lead can be surface mounted to the printed circuit board. The leads may extend from only one side wall of the housing. In this case, the housing may include a standoff on a bottom surface adjacent a side wall opposite the leads to balance the housing. Alternatively, stabilizing leads may be provided from the opposite side wall to improve horizontal mounting stability. To improve upright mounting stability, the leads may extend from the one side of the housing in two rows. The housing may be L-shaped to increase the separation between the two rows of leads. The semiconductor die package may house a sensor die or both a sensor die and a c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.