Silicon Bandwidth, Inc.,
34Patents
0Active
34Granted
36Portfolio score
Filing activity: Mar 11, 1994 → Sep 24, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6905367B2 | Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same | Electricity | 83 | Expired |
| US6461197B2 | Female contact pin including flexible contact portion | Electricity | 44 | Expired |
| USD430565S | Computer cabinet | General | 30 | Expired |
| US6663294B2 | Optoelectronic packaging assembly | Electricity | 25 | Expired |
| US6307258A | Open-cavity semiconductor die package | Electricity | 23 | Expired |
| US6078102A | Semiconductor die package for mounting in horizontal and upright configurations | Electricity | 21 | Expired |
| US6577003B1 | Semiconductor chip carrier affording a high-density external interface | Electricity | 18 | Expired |
| US6339191B1 | Prefabricated semiconductor chip carrier | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6305987A | Integrated connector and semiconductor die package | Electricity | 17 | Expired |
| US7123465B2 | Decoupling capacitor for an integrated circuit and method of manufacturing thereof | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6334794B1 | Electrical connector having staggered hold-down tabs | Electricity | 15 | Expired |
| US6247972A | Electrical connector assembly with a female electrical connector having internal flexible contact arm | Electricity | 15 | Expired |
| US6700138B2 | Modular semiconductor die package and method of manufacturing thereof | Physics | 13 | Expired |
| US6097086A | Semiconductor chip carrier including an interconnect component interface | Electricity | 12 | Expired |
| US6203347A | High-density electrical interconnect system | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6603193B2 | Semiconductor package | Electricity | 12 | Expired |
| US6574726B2 | Modular architecture for high bandwidth computers | Electricity | 11 | Expired |
| US7070340B2 | High performance optoelectronic packaging assembly | Electricity | 10 | Expired |
| US6847115B2 | Packaged semiconductor device for radio frequency shielding | Electricity | 10 | Expired |
| US6421254B2 | Multi-chip module having interconnect dies | Electricity | 10 | Expired |
| US6797882B1 | Die package for connection to a substrate | Electricity | 9 | Expired |
| USD447143S | Computer cabinet | General | 8 | Expired |
| US6857173B1 | Apparatus for and method of manufacturing a semiconductor die carrier | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6266246A | Multi-chip module having interconnect dies | Electricity | 6 | Expired |
| US6803650B2 | Semiconductor die package having mesh power and ground planes | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.