Method of making a printed circuit board having filled holes and fill member for use therewith
US6079100A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | May 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate such as a printed circuit board having at least one hole therein which comprises the steps of providing a layer of dielectric, forming at least one (and preferably several) holes therein, positioning a thin layer of support material atop the dielectric layer and over the hole(s), positioning a quantity of fill material on the thin layer of support material (preferably before positioning the thin layer on the dielectric) and thereafter applying a predetermined force sufficient to cause the thin support layer to rupture or otherwise deform (including melting from heat application thereto) such that the fill material is forcibly driven into the accommodating hole(s). Subsequent steps can include forming a layer of circuitry on the substrate's external surface and over the filled holes such that an electrical component such as a ball grid array (BGA), semiconductor chip, etc. may be directly positioned on and/or over the hole(s). A fill member usable with the method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.