Cleaning solution for cleaning substrates to which a metallic wiring has been applied
US6080709A · kind A · utility
22Cited by
8References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 11, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | Aug 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/26
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a cleaning solution for cleaning substrates, to which a metallic wiring has been applied, being capable of easily removing the metallic impurities of the substrate surface without corroding the metal, not putting a strain on the environment, and not causing a shelf life problem. The cleaning solution comprising at least one member selected from a group consisting of oxalic acid, ammonium oxalate and polyaminocarboxylic acids, but contains no hydrogen fluoride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.