Semiconductor device

US6081036A · kind A · utility

Assignee

• Matsushita Electronics Corporation · JP

Inventors

• Hiroshige Hirano · Nara, JP
• Toshiyuki Honda · Kyoto, JP

Key dates

• Filing date: Mar 9, 1998
• Grant date: Jun 27, 2000
• Expiry date: Mar 9, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/692

Abstract

A semiconductor device is provided wich includes a first wiring and second wirings in which end portions of the second wirings connected to the first wiring are bent parallel to that forms a predetermined angle with respect to the first direction. The first wiring extends along a first direction and has a wiring width direction in a second direction perpendicular to the first direction, where stresses are generated inside. The second wirings are situated above the first wiring, connected to the first wiring through a contact hole, and affected by the stresses of the first wiring.