Process and device for forming a coating on a substrate by cathode sputtering
US6083359A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/34
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a process for forming a coating on a substrate (2,2') by cate sputtering, comprising the coating of substrate surfaces (2,2') which have been transferred to a cathode sputtering chamber (1). The substrates vary in width and have a predetermined maximum width. The process involves the use of a target (3) whose surface (4) has an invariable length corresponding approximately to said maximum substrate width. A shift takes place, in accordance with the width of the substrate being coated, between the surface (4) of the target and the substrate surface to be coated, so that the entire surface of the target remains more or less constantly in front of the surface to be coated during the cathode sputtering process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.