Scanning exposure apparatus that compensates for positional deviation caused by substrate inclination
US6084244A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Jul 30, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7034
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A scanning exposure apparatus of the present invention is constructed in such an arrangement that while a mask and a substrate are moved relatively to a projection optical system, a pattern formed on the mask is projected for exposure through the projection optical system onto the substrate. The scanning exposure apparatus is provided with a leveling control portion for successively controlling an amount of relative inclination between the substrate and the mask with movement thereof, based on a predetermined leveling angle command .theta., so that an exposure area of the substrate becomes approximately coincident with an image plane of the pattern of the mask, a positional deviation measuring and control portion for measuring and controlling an amount of relative positional deviation between the mask and the substrate, and a positional deviation calculating and correcting portion for calculating an amount of relative positional deviation between the mask and the substrate, which will be caused by the control of the leveling control portion, based on the leveling angle command, and effecting correction of the relative positional deviation on the positional deviation measuring and c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.