Semiconductor device comprising stacked semiconductor elements
US6084294A · kind A · utility
80Cited by
11References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 3, 1999 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Feb 3, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrodes of a semiconductor element are connected to lead wires provided on a flexible substrate, thereby forming a structural unit of a semiconductor element. A plurality of structural unit of a semiconductor elements are stacked on a mounting board, and the lead wires of each flexible substrate are electrically connected to wiring patterns on the package board. The stacked structure units of semiconductor elements are sealed on a package board through use of resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.