Direct chip-cooling through liquid vaporization heat exchange
US6085831A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 1999 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Mar 3, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.