David J. Womac
9Patents
7h-index
15Co-inventors
56Inventor score
Filing activity: Jan 22, 1998 → Mar 8, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6085831A | Direct chip-cooling through liquid vaporization heat exchange | Electricity | 49 | Expired |
| US5981310A | Multi-chip heat-sink cap assembly | Electricity | 36 | Expired |
| US6373133B1 | Multi-chip module and heat-sink cap combination | Electricity | 19 | Expired |
| US6222263A | Chip assembly with load-bearing lid in thermal contact with the chip | Electricity | 12 | Expired |
| US8328026B2 | Apparatus and method for configuring a dual rack-mountable chassis | Electricity | 10 | Active |
| US6214647A | Method for bonding heatsink to multiple-height chip | Electricity | 9 | Expired |
| US6333460A | Structural support for direct lid attach | Electricity | 8 | Expired |
| US8944896B2 | Apparatus, system, and method for venting a chassis | Electricity | 4 | Active |
| US10036396B2 | Field configurable fan operational profiles | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.