Method of making a carrier for at least one wafer
US6086127A · kind A · utility
7Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Aug 3, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a wafer carrier for use in the transportation and storage of semiconductor wafers includes providing a unitary frame, forming a corrosion resistant coating, such as a fluoropolymer, covering the frame and providing wafer support elements mounted on the frame. A wafer carrier made by the present method may include a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.