Dual gas faceplate for a showerhead in a semiconductor wafer processing system
US6086677A · kind A · utility
938Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Jun 16, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45565
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A faceplate for a showerhead of a semiconductor wafer processing system having a plurality of gas passageways to provide a plurality of gases to the process region without commingling those gases before they reach the process region within a reaction chamber. The showerhead contains faceplate and a gas distribution manifold assembly. The faceplate defines a plurality of first gas holes that carry a first gas from the manifold assembly through the faceplate to the process region and a plurality of channels that couple a plurality of second gas holes to a plenum that is fed the second gas from the manifold assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.