Deposition systems and processes for transport polymerization and chemical vapor deposition
US6086679A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 1997 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Oct 24, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/061
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The described deposition systems are designed to accommodate new precursors and chemical processes used for transport polymerization and chemical vapor deposition. The systems consist primarily of a reactor, a liquid injector or gas mass flow controller, a cracker and a deposition chamber under sub-atmospheres pressure. The cracker utilizes one or more types of energy, including heat, photons, and plasmas. This invention is especially useful for preparing F-PPX (fluorinated poly(para-xylylenes) and other fluorinated polymer thin films for intermetal dielectric (IMD) and interlevel dielectric (ILD) applications in the manufacture of integrated circuits with features <0.25 .mu.m in size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.