Method for repairing surface defects
US6087191A · kind A · utility
11Cited by
6References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 22, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Jan 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for repairing defects in a surface layer of a substrate. The method comprises the redeposition, in a solvent environment, of a fill material into the defects of the surface layer. The fill material is provided by the surface layer itself or from a separate source comprising a different material from that of the surface layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.