Chip for multi-chip semiconductor device and method of manufacturing the same
US6087719A · kind A · utility
185Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Apr 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of chips each having two or more alignment holes for transmitting a laser beam are stacked. The laser beam is irradiated onto the uppermost or lowermost one of the stacked chips. A photodetector detects the laser beam output from the stacked chips through the alignment holes in these chips. The positions of the chips are so controlled that the amount of the light detected by this photodetector is a maximum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.