Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
US6087842A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1996 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Apr 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electromagnetic probe is integrated within an integrated circuit or mounted within an IC package to provide a capability for testing continuity between the integrated circuit and a substrate to which the integrated circuit is mounted. In a first embodiment, capacitive test probes are integrated within the integrated circuit, underneath bonding pads. In a second embodiment, Hall-effect devices are integrated within the integrated circuit underneath bonding pads. In a third embodiment, an inductive loop is integrated within the integrated circuit underneath bonding pads. In a fourth embodiment, an IC package assembly includes an internal capacitive test probe for electrical continuity testing. An internal shield may also be used as a capacitive test probe. In a fifth embodiment, an IC package assembly includes an inductive loop within the package for electrical continuity testing. The integrated or intrapackage test probes provide electromagnetic coupling to bonding pads or to a lead frame and to bonding wires (if present), to detect whether there is electrical continuity between an integrated circuit bonding pad or lead frame and conductors on an external substrate. The integrate…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.