Method for fabricating bump forming plate member
US6090301A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | May 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.