Koki Otake
12Patents
10h-index
28Co-inventors
68Inventor score
Filing activity: Aug 17, 1995 → Mar 31, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5643831A | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Electricity | 200 | Expired |
| US5920117A | Semiconductor device and method of forming the device | Electricity | 77 | Expired |
| US6025258A | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Electricity | 52 | Expired |
| US6319810A | Method for forming solder bumps | Electricity | 29 | Expired |
| US6090301A | Method for fabricating bump forming plate member | Electricity | 28 | Expired |
| US6271110A | Bump-forming method using two plates and electronic device | Electricity | 26 | Expired |
| US5747874A | Semiconductor device, base member for semiconductor device and semiconductor device unit | Electricity | 22 | Expired |
| US6022759A | Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit | Electricity | 21 | Expired |
| US6732911B2 | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system | Electricity | 14 | Expired |
| US6528346B2 | Bump-forming method using two plates and electronic device | Electricity | 12 | Expired |
| US8490857B2 | Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor device | Electricity | 2 | Active |
| US8336756B2 | Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.