Polyol-based precursors for producing nanoporous silica thin films
US6090448A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1998 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Jul 7, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to nanoporous dielectric films and to a process for their manufacture. Such films are useful in the production of integrated circuits. Such films are produced from a precursor of an alkoxysilane; a relatively low volatility solvent composition comprising an ether of a C.sub.1 to C.sub.4 alkylene glycol which is miscible in water and alkoxysilanes, having a hydroxyl concentration of 0.021 mole/cm.sup.3 or less, a boiling point of about 175 .degree. C. or more at atmospheric pressure and a weight average molecular weight of about 100 or more; a relatively high volatility solvent composition having a boiling point below that of the relatively low volatility solvent composition; optional water and an optional catalytic amount of an acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.