Multilayer wiring board for mounting semiconductor device and method of producing the same
US6090468A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Sep 9, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.