Thermally conductive filled polymer composites for mounting electronic devices and method of application
US6090484A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Apr 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31928
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive conformable interface layer for use in mounting electronic devices such as transistors or the like onto the surface of a chassis or heat sink. The thermally conductive interface material forms a highly conductive thermal bridge or transfer medium between the external surfaces of the electronic device and the heat sink. The thermally conductive material comprises a multi-layer laminate, typically a polymeric thermally conductive layer along with a film of adhesive bonded thereto. The polymeric layer is preferably a silicone resin, such as polydimethylsiloxane blended with a thermoplastic adhesive such as linear saturated polyester. The polydimethylsiloxane may be filled with a thermally conductive material such as graphite with an adhesive layer being utilized to attach the polymeric layer onto the device and heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.