Multiple-plane pair thin-film structure and process of manufacture
US6090633A · kind A · utility
26Cited by
24References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1999 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Sep 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multiple plane pair thin-film structure and a process for the manufacture of that structure. The multiple plane pair thin-film structure is of modular design and manufacture, such that each module comprising the structure is manufactured and tested individually before assembly. The thin film wiring structure is comprised of a plurality of true plane pair thin-film structures. Each such plane pair thin-film structure is manufactured as a module, the functionality of which can be tested for conformity to applicable specifications. Each module is designed and fabricated as a plane pair thin-film structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.