Patent · US Expired

Method of making copper alloys for chip and package interconnections

US6090710A · kind A · utility

42Cited by

22References

16Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Panayotis Andricacos · Ossining, US
Hariklia Deligianni · Alpine, US
James M. E. Harper · Yorktown Heights, US
Chao-Kun Hu · Somers, US
Dale J. Pearson · Carmel, US
Scott K. Reynolds · Amawalk, US
King-Ning Tu · Hsinchu, TW
Cyprian Emeka Uzoh · San Jose, US

Key dates

Filing date	Aug 15, 1997
Grant date	Jul 18, 2000
Priority date	—
Expiry date	Aug 15, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/265
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of making Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin is disclosed for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package interconnections and conductors by first forming the copper alloy and then annealing it to cause the diffusion of the alloying element toward the grain boundaries between the grains in the alloy are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.