Piece-wise processing of very large semiconductor designs
US6091072A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Oct 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31764
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and method of converting large Integrated Circuit (IC) designs into patterns. First, based on shape density, the design is fragmented into pieces, each piece including roughly the same number of shapes. Next, a band of shapes, all within the proximity correction area for each piece, are identified. Each piece, including its identified band, is processed individually to convert data within the piece and within the proximity correction band to Numerical Control (NC) data. The NC data for the proximity correction band is discarded. The piece's NC data is stored as an NC data file for the piece. This is repeated until all of the pieces are converted to NC data. Finally, the pattern is written, one piece at a time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.