Method of surface finishes for eliminating surface irregularities and defects
US6093335A · kind A · utility
3Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1997 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Nov 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for planarizing an exposed metal surface on a substrate is provided in which surface irregularities are eliminated. A photoresist layer is first removed from the substrate. Then a conformal planarizing head is placed in contact with the metal surface while chemical etchant essentially free of abrasives is supplied to an interface between the metal substrate and the planarizing head. The surface is then planarized until it is free of irregularties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.